These activated formulations are recommended for use in applications involving high speed wave soldering

Higher activity level than standard RMA fluxes, yet still conforms to the MIL-F-14256 Type RMA. Formula 185-15 is recommended for soldering surface mount assemblies.

Highest level of activity for a Type RMA flux, making it particularly suitable ofr the soldering of multi-layer printed circuit boards. Formulas 186-18 and 186-25 are more suitable for soldering surface mount assemblies.

Original standard Type RMA flux formulation.

For automated wave soldering of PCB assemblies where more aggressive flux is required. Recommended for soldering multi-layer printed circuit boards. Formulated to minimize icicling and bridging. Exhibits high ionic cleanliness after water cleaning with...

Kester 2222-CL is a high activity, organic acid flux designed for automated wave solder applications where a more aggressive flux is required to solder difficult assemblies. The flux will provide maximum capillary wetting action up plated through-holes...

For automated wave or drag soldering processes. Residue can be removed completely without neutralizers in water. Complies with IPC-SF-818 Type H3C. Has improved stability in low temperature storage without performance loss. Reduced foaming in water...