No Clean Fluxes

Leaves printed circuit boards exhibiting a high surface insulation resistance (1011*).

Causes printed circuit board assemblies to exhibit a very dry, clean appearance.

Passes insulation resistance for Class 3 (high reliability) products, is classified as Type M under IPC-SF-818, and conforms to Bellcore TR-TSY-000078 specifications.

Has improved wetting characteristics with superior reliability properties. Designed for bare copper and multi-layer boards and for soldering under inert atmosphere. Meets IPS-CF-818 Type L3CN, and Bellcore TR-TSY-000078 specifications.

Passes insulation resistance requirement for Class 3 products, QPL approved for MIL-F-14256-F Type LR-L, conforms to IPC-SF-818 Type L3CN, and Bellcore TR-TSY-000078 specifications.

Passes insulation resistance requirement for Class 3 products, QPL approved for MIL-F-14256-F Type LR-L, conforms to IPC-SF-818 Type L3CN, and Bellcore TR-TSY-000078 specifications.

Low Solids, No-Clean. Designed for wave soldering applications, gives excellent soldering performance on bare copper PCBs. Bellcore Issue 1 GR-78-CORE & ANSI/J-STD-004. Flux designator ROL0.

A method of removing SMDs by reducing the reflow temperature to below 300° Fahrenheit, all potential damage to the circuit board is eliminated.

Flux remover for no-clean flux. Non-flammable CFC free, contains HCFC's. Test on plastic.