VOC Free , Water Soluble Fluxes

Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.

Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.

Designed for foam applications. VOC-Free, no clean flux that is water based, water soluble, halide free, non-flammable and eliminate the need for a flux thinner.

Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a lager process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spary applications.