Kester Alcohol Based, No Clean Fluxes
Halogen-free, rosin free organic fluxes designed for the high speed wave soldering of through hole and surface mount printed circuit board assemblies. Non-corrosive and non-conductive, with most having an extremely low solids content, and all leaving no residue after soldering. If cleaning is desired, or required by contract, Kester’s Bio-Kleen® saponifier in a warm water wash system can be used. All these fluxes are designed for application with foam fluxing equipment.
Leaves printed circuit boards exhibiting a high surface insulation resistance (1011*).
Passes insulation resistance for Class 3 (high reliability) products, is classified as Type M under IPC-SF-818, and conforms to Bellcore TR-TSY-000078 specifications. Halogen-free, rosin free organic fluxes designed for the high speed wave soldering of...
Passes insulation resistance requirement for Class 3 products, QPL approved for MIL-F-14256-F Type LR-L, conforms to IPC-SF-818 Type L3CN, and Bellcore TR-TSY-000078 specifications.
Passes insulation resistance requirement for Class 3 products, QPL approved for MIL-F-14256-F Type LR-L, conforms to IPC-SF-818 Type L3CN, and Bellcore TR-TSY-000078 specifications.
Low Solids, No-Clean. Designed for wave soldering applications, gives excellent soldering performance on bare copper PCBs. Bellcore Issue 1 GR-78-CORE & ANSI/J-STD-004. Flux designator ROL0.
Passes insulation resistance for Class 3 (high reliability) products, is classified as Type M under IPC-SF-818, and conforms to Bellcore TR-TSY-000078 specifications.
Halogen-free, rosin free organic fluxes designed for the high speed wave soldering of through hole and surface mount printed circuit board assemblies.
Contains very small percentage of rosins which improves solderability, heat stability and surface insulation.
Non-corrosive, non-conductive tack-free residues. Suitable for leaded and lead-free alloys.
Contains very small percentage of rosins which improves solderability, heat stability and surface insulation.
Non-corrosive, non-conductive tack-free residues. Suitable for leaded and lead-free alloys.