Kester VOC-Free, Water Based No Clean Fluxes
This new organic water soluble, water based, halide-free flux chemistry was developed to meet the environmental concerns associated with soldering high quality PCB assemblies. These fluxes contain no ozone depleting chemicals or volatile organic compounds, are non-flammable, have no offensive odors and will not attack properly cured solder masks or FR-4 laminates.
Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.
Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.
Designed for foam applications. VOC-Free, no clean flux that is water based, water soluble, halide free, non-flammable and eliminate the need for a flux thinner.
Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a lager process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spary applications.
Designed for foam applications. VOC-Free, no clean flux that is water based, water soluble, halide free, non-flammable and eliminate the need for a flux thinner.