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No-Clean
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Water-Soluble
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Solder Paste
for Stencil Printing Applications, Jar or Cartridge
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Formula
Type
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Easy
Profile® 256
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R244
|
HydroMark 531
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R562
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R560
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|
Alloy
|
Sn63Pb37
|
Sn63Pb37
|
Sn63Pb37
|
Sn63Pb37
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Sn63Pb37
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| Product
Characteristics |
Designed for maximum robustness
in reflow profiling and printing. Contains the widest possible reflow processing
window. Capable of printing downtimes of up to 90 minutes with an effective
first print down to 20 mils. Maintains its activity and printing characteristics
for up 8 hours without any shear thinning. Compatible with enclosed print head
systems.
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Full residue, standard no-clean
paste for all reflow applications. R244 has been an industry standard formula
that combines many good properties into a user friendly product
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Designed as an all-purpose
water-soluble paste, Hydro Mark 531 provides consistent hours of stable stencil
life, tack time, and printing characteristics. Offers improved anti-slump characteristics
along with excellent solderability to a wide range of surface and component
lead metallizations, solving problems caused by slumping, bridging, and wetting.
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A general application water-soluble
paste that demonstrates exceptional characteristics in all weather environments
and reduced voiding in BGA attach operations. R562 maintains its print characteristics,
tack, and activity even after prolonged exposure to environmental extremes.
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Designed to reduce voiding
in BGA solder connections and print over a range of environmental conditions.
R560 features extremely stable stencil and tack life, while exhibiting excellent
wetting to a variety of metalizations. Compatible with enclosed print head
systems.
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| Residue
Removal |
Not normally required.
|
Not normally required.
|
Use de-ionized or soft
tapwater at 120-140°F.
|
Use de-ionized or soft
tapwater at 120-140°F.
|
Use de-ionized or soft
tapwater at 120-140°F.
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| Expected
Tack Life |
12+ hours
|
8+ hours
|
8+ hours
|
8+ hours
|
8+ hours
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| Atmosphere Required for Reflow |
Air or Nitrogen
|
Air or Nitrogen
|
Air or Nitrogen
|
Air or Nitrogen
|
Air or Nitrogen
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| Compliant Specifications |
Telcordia Issue
1GR-78-ORE,
IPC/ J-STD-004
Classification ROL0
|
Telcordia Issue
1GR-78-ORE,IPC/ J-STD-004
Classification ROL0
|
IPC/ J-STD-004 Classification
ORM0
|
IPC/ J-STD-004
Classification ORH0
|
IPC/ J-STD-004
Classification ORH0
|
| Powder Mesh Size |
-325/+500 (Type
3)
|
-325/+500 (Type
3)
|
-325/+500 (Type
3)
|
-325/+500 (Type
3)
|
-325/+500 (Type
3)
|
| Metal % |
90%
|
90%
|
90%
|
90%
|
90%
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| |
Solder Paste for Stencil Printing Applications,
Syringes
|
| Formula
Type |
R276
|
R500
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| Alloy |
Sn63Pb37
|
Sn63Pb37
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| Product
Characteristics |
Provides optimal
performance in all types of dispensing applications. R276 is packaged void-free
to ensure consistent dispensing in high speed automated processes. Exhibits
excellent dispensing characteristics with a wide range of needle diameters.
|
The activator package
in this formula is aggressive enough to remove tenacious oxide layers or solder
to OSP coated boards. R500 delivers excellent wetting characteristics.
|
| Residue
Removal |
Not normally required.
|
Use
de-ionized or soft tapwater at 120-140°F.
|
| Expected
Tack Life |
8+ hours
|
8+ hours
|
| Atmosphere
Required for Reflow |
Air or Nitrogen
|
Air or Nitrogen
|
| Compliant
Specifications |
Telcordia Issue
1GR-78-ORE,
IPC/ J-STD-004 Classification ROL0
|
IPC/ J-STD-004
Classification ORH0
|
| Powder
Mesh Size |
-325/+500 (Type
3)
|
-325/+500 (Type
3)
|
| Metal
% |
87%
|
87%
|