Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processing window.

Kester Puremark 202 saves you time and money because it allows you to set up your print job right the first time without rushing. PureMark 202 gives you up to 2 hours of set up time, which means less paste goes to waste. Consistent print volume regardless

Designed to provide maximum print characteristics and solderability.

Kester’s NXG1 lead-free no-clean solder paste represents a breakthrough in lead-free technology with a best-in-class combination of superior wetting behavior, shiny joints, excellent printing and the longest shelf life available. Backed by Kester’s...