Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processing window.

Designed as an all-purpose water-soluble paste, Hydro Mark 531 provides consistent hours of stable stencil life, tack time...

Kester Puremark 202 saves you time and money because it allows you to set up your print job right the first time without rushing. PureMark 202 gives you up to 2 hours of set up time, which means less paste goes to waste. Consistent print volume regardless

The activator package in this formula is aggressive enough to remove tenacious oxide layers or solder to OSP coasted boards.

A general application watersoluble paste that demonstrates exceptional characteristics in all weather environments and reduced voiding in BGa attach operations.

The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability.