Kester Fluxes for Lead Free Solders
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Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.
Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.