all Kester Lead free soldering products

Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.

Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.


Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed.

Kester lead-free bar ensures faster wetting. Its unique shape differentiates it from leaded bars.


The powerful flux remover for high temperature, lead-free flux removal

The powerful flux remover for high temperature, lead-free flux removal

Kester sn96.5Ag3.0cu0.5-.025-275-58c wire solder 1 lb spool

Kester sn96.5Ag3.0cu0.5-.031-275-58c wire solder 1 lb spool

Kester sn96.5Ag3.0Cu0.5-.062-275-58c wire solder 1 lb spool

Kester sn96.5Ag3.0Cu0.5-.025-331-66c wire solder 1 lb spool

Kester sn96.5Ag30Cu0.5-.031-331-66c wire solder 1 lb spool.

Kester sn96.5Ag3.0Cu0.5-.062-331-66c wire solder 1 lb spool