Lead Free Paste Solder

Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed.