Solder Masks

The high temperature, peelable temporary mask ideal for lead-free applications.

Teporarily mask areas of printed circuit boards. Masking compounds conform to the military specification MIL-STD-2000 paragraph 5.3.18, parts a,b,&d.

Teporarily mask areas of printed circuit boards. Masking compounds conform to the military specification MIL-STD-2000 paragraph 5.3.18, parts a,b,&d.

Teporarily mask areas of printed circuit boards. Masking compounds conform to the military specification MIL-STD-2000 paragraph 5.3.18, parts a,b,&d.

Teporarily mask areas of printed circuit boards. Masking compounds conform to the military specification MIL-STD-2000 paragraph 5.3.18, parts a,b,&d.

Teporarily mask areas of printed circuit boards. Masking compounds conform to the military specification MIL-STD-2000 paragraph 5.3.18, parts a,b,&d.

Teporarily mask areas of printed circuit boards. Masking compounds conform to the military specification MIL-STD-2000 paragraph 5.3.18, parts a,b,&d.

A flexible, high temp. latex soder masking compound designed for the temporary masking of areas on printed circuit boards.

A flexible, high temp. latex soder masking compound designed for the temporary masking of areas on printed circuit boards.

High-temperature flexible solder masking compound formulated from natural latex rubber to protect delicate components. Heat stable and tacky enough to be applied to boards during wave soldering.


Chemask® NA, an ammonia-free, peelable, temporary solder mask is now available.

Designed for Closed Loop/In-Line Systems. 100% Water Soluble. Lead-Free Compatible. Safe on Ion Bed & Filters.

High-temperature flexible solder masking compound formulated from natural latex rubber to protect delicate components. Heat stable and tacky enough to be applied to boards during wave soldering.