No Clean Paste Solder

Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processign window.

Designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processign window.

Kester Puremark 202 saves you time and money because it allows you to set up your print job right the first time without rushing. PureMark 202 gives you up to 2 hours of set up time, which means less paste goes to waste. Consistent print volume regardless

Provides optimal performance in all types of dispensing applications.