Water Soluble Paste Solder
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Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed.
Designed as an all-purpose water-soluble paste, Hydro Mark 531 provides consistent hours of stable stencil life, tack time...
Designed as an all-purpose water-soluble paste, Hydro Mark 531 provides consistent hours of stable stencil life, tack time, and printing characteristics.
The activator package in this formula is aggressive enough to remove tenacious oxide layers or solder to OSP coasted boards.
Designed to reduce voiding in BGA solder connections and print over a range of environmental conditions.
A general application watersoluble paste that demonstrates exceptional characteristics in all weather environments and reduced voiding in BGa attach operations.
Water soluble solder paste formulated to reduce voiding and provides excellent wetting and ease-of-cleaning. Extremely stable...
The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes...
Organic acid, water-soluble solder paste designed to resist drying out in low humidity or slumping in high humidity. Maintains...
On Sale! Limited time offer while supplies last.
HydroMark 531 Water-Soluble Solder Paste, 500g Jar. Alloy: Sn62Pb36Ag02. Kester HydroMark 531 is an organic acid, water soluble solder paste that...