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Kester EM808 Solder Paste, Water-Soluble, Lead-Free, 600g

Kester EM808 Solder Paste, Water-Soluble, Lead-Free, 600g KEP-7003060811


EnviroMark™ 808 Lead-Free Water-Soluble Solder Paste, Stencil Printing, Sn96.5Ag03Cu0.5 325, 600g Cartridge
The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes promote good wetting and deliver excellent solder joint integrity at the higher temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Cu (tin-silver-copper).

Specifications
Product Characteristics:Provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed. The activator package is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards.
Residue Characteristics:Cleanable in warm water
Idle Time:60 minutes at 70°-77°F and 40-60% R.H.
Max Print Speed:Up to 150 mm/sec.
Expected Stencil Life:8+ hour stencil life
Compliant Specifications: IPC/J-STD-004 Flux Designator 0RM0

Kester EM808 Datasheet
Kester EM808 MSDS

* PLEASE NOTE: Solder Paste must ship overnight via air freight in a refrigerated condition. We will contact you to discuss the extra freight charges that will apply.

Manufacturer Part Number: 7003060811
KEP-7003060811
This item is temporarily out of stock.
 
Your Price $178.00
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