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Kester EM828 Lead-Free Solder Paste, 500g Jar

All paste shipments must ship UPS Next Day Air. An additional charge applies. We will contact you regarding that amount.



The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at higher temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Cu (tin-silver-copper). Please call 1-800-492-7726 for more information.

Alloy: Sn96.5Ag3.0Cu0.5

Formula: EnviroMark™ 828 Water-Soluble
Stencil Printing
Product Characteristics: Water soluble solder paste formulated to reduce voiding and provides excellent wetting and ease-of-cleaning. Extremely stable in the stencil printing process regardless of print speed, idle time and throughput. Excellent wetting on a variety of metallizations.
Residue Characteristics: Hot DI Water
Idle Time: Up to 60 minutes without any kneading
Max Print Speed: Up to 6”/s (150mm/s)
Expected Stencil Life: 8 hours
Compliant Specifications: IPC/J-STD-004 Flux Designator ORH1

Mfr. Part No. 7004030810

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