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Kester Easy Profile 256HA No-Clean Solder Paste for Stencil Printing Applications, 500g Jar

Easy Profile 256HA No-Clean, 500g Jar WAS-01-021209
Alloy: Sn63Pb37
Product Characteristics: Designed to provide maximum print characteristics and solderability. For applications requiring the ultimate activity for difficult to solder components and board surface metallizations. High activity on all substrates, including OSPs. Excellent printing characteristics to 0.4mm (16 mil) pitch. High print speeds to 150 mm/sec (6”/sec)
Residue Removal: Not normally required.
Expected Tack Life: 8+ hours
Atmosphere Required for Reflow: Air or Nitrogen
Compliant Specifications: Telcordia Issue 1GR-78-ORE, IPC/J-STD-004 Classification ROL0
Powder Mesh Size: -325/+500 (Type 3)
Metal %: 90%

Manufacturer Part Number: 7002020510
Alternate Part Number: WAS-01-021209
KEP-7002020510
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Your Price $65.83
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