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Kester Flux 977 1-gal. Container

Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a lager process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spary applications.Completely new, organic, no-clean formulation for high quality, low-defect soldering of electronic circuit board assemblies. Free of any volatile organic compounds (VOCs), solvents that may react photochemically to form air pollution. Finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. Excellent soldering properties lead to higher productivity without sacrificing reliability of the assembly. Reduces microsolderballing on glossy laminates and between connector pins. Classified as ORL0 per ANSI-J-STD-004, it will not attack properly cured solder masks or FR-4 Epoxy-Glaslaminate. After use, the cosmetic appearance of the board's surface is excellent. Leaves no haze or visible residue behind, including the white powdery residue associated with the use of earlier no-clean formulas. The miniscule amount of non-visible residue that remains after soldering is non-conductive, non-corrosive and does not have to be removed. The residues will not interfere with in-circuit testing probes. Not detrimental to Surface Insulation Resistance (SIR) of soldered assembly. If the user still chooses to clean circuit board assembly because of process considerations, the minute amount of non-visible reside can be washed easily with plain, warm water (110-130°F). Can be applied to circuit boards by spray or dip process. Flux deposition should be 750-1500 µg/in².

Manufacturer Part Number: 977-GL
Alternate Part Number: WAS-01-023977

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