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Kester Flux 979, 1-gal. Container

Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill. Completely new, organic, no-clean formulation for high qualifty, low-defect soldering of electronic ciruit board assemblies. Free of any volatile organic compounds (VOCs), solvents that may react photochemically to form air pollution. Finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. Excellent soldering properties lead to higher productivity without sacrificing relability of the assembly. Reduces microsolderballign on glossy laminates and between connector pins. Classified as ORL0 per ANSI-J-STD-004, it will not attack properly cured solder masks or FR-4 Epoxy-Glaslaminate. After use, the cosmetic appearance of the board's surface is excellent. Leaves no haze or visible residue behind, including the white powdery residue associated with the use of earlier no-clean formulas. The miniscule amount of non-visible residue that remains after soldering is non-conductive, non-corrosive and does not have to be removed. The residues will not interfere with in-ciruit testing probes. Not detrimental to Surface Insulation Resistance (SIR) of soldered assembly. If the user still chooses to clean circuit board assembly because of process considerations, the minute amount of non-visble reside can be washed easily with plain, warm water (110-130°F). Can be applied to circuit boards by spray or dip process. Flux depoisition should be 750-1500 µg/in².

Manufacturer Part Number: 979-GL
Alternate Part Number: WAS-01-002979

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