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Kester NXG1 No Clean Lead Free Solder Paste, SAC305, 600g Syringe

Kester’s NXG1 lead-free no-clean solder paste represents a breakthrough in lead-free technology with a best-in-class combination of superior wetting behavior, shiny joints, excellent printing and the longest shelf life available. Backed by Kester’s world renowned customer service, technical service expertise, and 110 plus years experience in soldering technology, NXG1 lead-free no-clean paste is the only product that satisfies all your assembly needs.

• Superior Solderability - The NXG1 provides the smoothest & shininess joints of any lead-free paste on the market; the difference from SnPb to lead-free is virtually transparent.
• Ultra-low BGA Voiding - Low void performance is a must for most assemblies today reducing rework costs & improving first pass yields.
• Reduced Ball-In-Socket Defects - Designed specifically to reduce or fully eliminate the occurrence of ball-in-socket (also know as head-in-pillow and foot-in-mud) defects.
• Excellent Printability - Consistent solder paste volume deposits regardless of idle time, stencil life & print speed. This is the most important characteristic of any solder paste, as print volume inconsistency is the top cause of defects in electronic assembly.
• Longest Shelf Life - NXG1 has the longest shelf life, at 8 months, of any lead-free no-clean paste on the market. A longer shelf life will help reduce scrap & waste while allowing for more manageable inventory.

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