Alloy: Sn96.5Ag3.0Cu0.5

Product Characteristics: Lead-free, halogen-free solder paste with state-of-the-art capabilities to support modern electronics assembly challenges. Capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. Handles a wide variety of printer variables, including print speed, long idle times and a wide range of temperature and humidity. Low slump behavior minimizes defects, including head-in-pillow and QFN/BGA voiding. Tremendous solderability. ICT probeable residues.

Residue Removal: Not normally required

Expected Tack Life: Stable for at least 24 hours