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Kester R520A Water Soluble, 600g Cartridge

All paste shipments must ship UPS Next Day Air. An additional charge applies. We will contact you regarding that amount.

The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at higher temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Cu (tin-silver-copper). Please call 1-800-492-7726 for more information.

Alloy: Sn96.5Ag3.0Cu0.5

Formula: R520A Water-Soluble
Stencil Printing
Product Characteristics: The 520A is designed to solder effectively difficult metal surfaces in an air or nitrogen reflow atmosphere. The activator package is able to withstand the higher temperatures without slump. The flux system is non-hygroscopic, reducing paste waste at the printer. It is available in all common lead-free alloys.
Residue Characteristics: Cleanable in warm water
Idle Time: 90 minutes at 70°-77°F and 40-60% R.H.
Max Print Speed: Up to 150 mm/sec.
Expected Stencil Life: 8+ hours at 70°-77°F and 40-60% R.H.
Compliant Specifications: IPC/J-STD-004 Flux Designator ORH0

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