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Kester Solder, EM808 Water Soluble, 500g Jar, Paste Solder

EM808 Water Soluble, 500g Jar WAS-01-02609
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The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at higher temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Cu (tin-silver-copper).

Alloy: Sn96.5Ag3.0Cu0.5

Formula: EnviroMark™ 808 Water-Soluble
Stencil Printing
Product Characteristics: Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808’s robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed. The activator package is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards.
Residue Characteristics: Cleanable in warm water
Idle Time: 60 minutes at 70°-77°F and 40-60% R.H.
Max Print Speed: Up to 150 mm/sec.
Expected Stencil Life: 8+ hour stencil life
Compliant Specifications: IPC/J-STD-004 Flux Designator 0RM0

Mfr Part No. 7003060810
KEP-7003060810
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