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Kester Solder, EM808 Water Soluble, 500g Jar, Paste Solder

EM808 Water Soluble, 500g Jar WAS-01-02609
Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed. The activator package is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards.The key variables in lead-free SMT are higher reflow temperatures, flux activity, reside characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at highter temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Ci (tin-silver-copper). Please call for more information.
WAS-01-02609
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Your Price $100.50
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