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Kester Solder, EM907 No-Clean, 600g Cartridge, Paste Solder

All paste shipments must ship UPS Next Day Air. An additional charge applies. We will contact you regarding that amount.

The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at higher temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Cu (tin-silver-copper).

Alloy: Sn96.5Ag3.0Cu0.5

Formula: EnviroMark™ 907 No-Clean
Stencil Printing
Product Characteristics: Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC). Joints are cosmetically bright as SnPb joints. Prints down to 0201 pad sites. Designed to reflowable in air as well as nitrogen. The key variables in lead-free SMT are higher reflow temperatures, flux activity, reside characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at highter temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Ci (tin-silver-copper).
Residue Characteristics: Light colored
Idle Time: 60 minutes at 70°-77°F and 40-60% R.H.
Max Print Speed: Up to 150 mm/sec.
Expected Stencil Life: 12+ hours (process dependent)
Compliant Specifications: Telcordia Issue 1 GR-78-CORE IPC/J-STD-004 Flux Designator R0L0

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